Advanced Interconnect And Packaging

RM419.00
+ RM146.49 Shipping

Advanced Interconnect And Packaging

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Advanced Interconnect And Packaging

RM419.00

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Product details

Advanced Interconnect And Packaging

Unlike Transistors, The Continuous Downscaling Of Feature Size In Cmos Technology Leads To A Dramatic Rise In Interconnect Resistivity And Concomitant Performance Degradation. At Nanoscale Technology Nodes, Interconnect Delay And Reliability Become The Major Bottlenecks Faced By Modern Integrated Circuits. To Resolve These Interconnect Problems, Various Emerging Technologies, Including Airgap, Nanocarbon, Optical, And Through-silicon Via (tsv), Have Been Proposed And Investigated.
  • Brand: MDPI AG
  • Category: Computing & Internet
  • Format: Hardcover
  • Language: English
  • Publication Date: 2023-02-20
  • Publisher / Label: MDPI AG
  • Author: MDPI AG
  • Number of Pages: 266
  • Fruugo ID: 557203258-1125472684
  • ISBN: 9783036567334
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  • STANDARD: RM146.49 - Delivery between Mon 09 November 2026–Mon 07 December 2026

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