Powerful heating performance: This heated glue removal table uses a robust heating element that rapidly reaches 160 250 C, optimizing the degumming process for efficient repairs. Broad compatibility: Compatible with more than 99% of market chips, including CPUs and power chips in phones and computers, making it a versatile addition to your toolkit. Innovative fixture design: The fixture provides secure clamping on a variety of motherboard shapes, delivering stability during operation. Easy to use: Simple operation suitable for technicians of all levels. The low voltage design reduces static risk, and LED indicators show the current temperature level. Use scenario 1: Smartphone motherboard service. Use the table to warm adhesive around BGA packages, enabling safe removal of chips during component replacement and . Use scenario 2: Laptop motherboard . Degum and rework power ICs or CPUs on notebook boards with secure clamping to maintain stability during heat application. Use scenario 3: General board workflow. Works across different motherboard shapes and device types, providing a reliable solution for efficient degumming and chip replacement in a .