Specification: Origin: Mainland China Core: Xtensa dual-core 32-bit LX7 CPU, up to 240MHz Memory: 384 KB ROM 512 KB SRAM 16 KB RTCSRAM 8 MB PSRAM Operating voltage: 3 V to 3.6 V Up to 45 GPIOs 2*12-bit ADC (up to 20 channels) Communication interface 2 I2 C interfaces 2 125 interfaces 4 SPI interfaces 3 UART interfaces 1 USB OTG interface Security: 4096-bit OTP AES, SHA, RSA, ECC, RNG Secure boot, Flash encryption, digital signature, HMAC module Extended temperature range: -40 to 65 C Dimensions: 57.00x28.00x5.00mm/2.24x1.1x0.2inch Material: mixed material Note: Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you! Please allow 1-2cm measuring deviation due to manual measurement. Included: 1 x ESP32-S3 Development Board 1 x Camera(optional) 1.Low Power Consumption: The ESP32-S3 CAM board is a low-power MCU system-on-chip (SoC) that integrates 2.4 GHz Wi-Fi and low-power BT dual-mode wireless communication. 2.Superior Performance: The ESP32-S3 core board features a complete Wi-Fi subsystem and low-power BT subsystem, offering industry-leading low power and RF performance. 3.Versatile Power Modes: The development board kit supports various low-power operating states, catering to the power consumption needs of diverse application scenarios. 4.Rich Interfaces: The WiFi BT Module provides a wide range of peripheral interfaces and includes multiple unique hardware security mechanisms. 5.Enhanced Security: The CAM development board's comprehensive security mechanisms enable the chip to meet stringent security requirements.