Features: Before the opening, the temperature of the solder paste should be raised to the ambient temperature (25℃), and the temperature return time- should be about 3-4 hours. It is forbidden-to use other heaters to raise the temperature instantaneously. After the solder paste is opened, it is recommended- to use it within 24 hours at room temperature. Placed in the-air for a-long-time, the solder paste will become a tin- block due to moisture absorption. The indoor temperature should be controlled at 22-28℃, and the humidity RH30-60% is the best working environment. To wipe the wrong substrates, it is recommended- to use industrial cleaner. Specifications: Material:Tin- Type:XGSP30 (21g),XGSP40 (36g),XGSP50 (43g),XGSP80 (61g) Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT- soldering, BGA welding process, etc. Package Includes: 1x Solder Paste note: Please allow 1mm errors due to manual measurement. Due to the difference between different monitors, the picture may not reflect the actual color of the item.