Wide Application: Boasts strong continuous pressure performance, ideal for welding fine-pitch ICC, BGA, and precision components. Perfect for circuit boards, ICs, phones, TVs, and other household appliances and industrial equipment. PCB Welding: High-temperature solder paste is suitable for PCB welding of various materials with high demands, fine pitches, and high-precision components, ensuring minimal tin connection displacement. Excellent Features: With a melting point of 217℃, this solder paste offers good wettability, de-molding, cold collapse resistance, hot collapse resistance, and dry resistance. Reliable Performance: Delivers full tin, bright tin beads, minimal residue, and is free from extremely corrosive substances. Product Specifications: Eco-friendly high-temperature solder paste with Sn96.5, Ag3, Cu0.5 alloy, a 217℃ high melting point, and a net weight of 60g. Particle size: 20-38μm.