1、138℃ Melting Point: The melting point of this low temperature solder paste is approximately 138℃. 2、20 to 45um: This tin soldering paster possesses 60PaS stickness, 20 to 45um particles. 3、High Reliability: Reflow does not produce tin beads and tin bridge, more reliable to use. 4、Wide Application: This soldering paster is applicable to sensor, wire, motor, fuse, connector, metal shell, lighting, electronic components, SMT maintenance, etc 5、Warm Tip: This welding soldering paster features good wedling performance. The recommended storage temperature is 5℃ to 10℃ Item Type: Solder Paste Material: Pasty Fluid Low Temperature: BS458 Low Temperature Stickness: 60 (Pa·S) Particle: 25 to 45 (um) Product Packaging: 40G / Bottle, 40 Bottles / Box Scope of Application: Used for SMT Industry Printed Circuit Board Surface Electric, Capacitor, JC Electronic Components Welding. Storage Conditions: The Recommended Storage Temperature is 5℃ to 10℃ 1 x Solder Paste