Style: SOP8150mil 8pin smalloutline package (SOP), body width 150 mil (3.81 mm). Designed for surfacemount assembly and standard SOP8 footprints. Key attributes Package type: 8pin SOP Size: 150 mil body width (3.81 mm) Mounting: Surfacemount package suitable for common reflow soldering processes Material: Plastic encapsulation with metal leads (typical for SOP packages) Compatibility: Standard SOP8 PCB footprints and assembly workflows Performance: Provides reliable electrical and mechanical characteristics in a compact form factor Benefits Compact footprint enables tighter PCB layouts and higher component density Broad compatibility with standard SOP8 ICs and suppliers Suitable for automated SMT assembly and reliable solder joints The 8pin format supports a range of small signal and control ICs without increasing board area Use scenarios Opamp or comparator circuits on a compact control board where space is at a Voltage regulator or levelshifting ICs in embedded systems requiring a small footprint Small signal driver or interface ICs in consumer electronics with limited PCB area