Compatible with DFN8, QFN8, and WSON8 packages, this probe line is designed for chip online data burning and serves as a read/write burning needle. Key features Function: Provides probe line access for incircuit data burning on chips, enabling read and write operations during programming. Compatibility: Suitable for DFN8, QFN8, and WSON8 package types. Size / pitch: Pin spacing 1.27 mm, supporting common 8pin package layouts. Performance focus: Built to support reliable inline programming tasks on appropriate package types. Applications and use scenarios Production line inline programming: Use on the PCB assembly line to burn firmware or calibration data into DFN8/QFN8/WSON8 devices without removing components. Incircuit firmware updates: Perform firmware updates or data rewriting on boards with installed DFN8/QFN8/WSON8 ICs during test or final verification. Research and development testing: Utilize for development boards and prototypes to read, verify, and burn data into 8pin packages during iterative testing. Notes The description adheres to the stated package compatibility, function, and pin spacing, without adding unsupported details.